SIM-kaartferbining, PUSH PUSH, 8P+1P, H1.85mm, sûnder post KLS1-SIM-074B
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| SIM-kaartferbining, PUSH PUSH, 8P+1P, H1.85mm, sûnder post Materiaal: Húsfesting: Hege temperatuer Termoplastysk, UL94V-0. Swart. Kontakt: Koperlegering. Omslach: Kontakt: Koperlegeringen of stiel. Plating: Underplaat: Nikkel. Kontaktgebiet: Goud oer nikkel. Soldeergebiet: Tin oer Nikkel. Shell: G/F-plaat oer nikkel op soldeersturten Elektrysk: Hjoeddeiske wurdearring: 0.5A. Spanningswurdearring: 5.0 Vrms. Isolaasjeresistinsje: 500M Min. By DC 500V DC Wjerstân tsjin spanning: 250V ACrms foar 1 minút. Kontaktresistinsje: 100M Max. By 10MA/20mVMAKS. Bedriuwstemperatuer: -45ºC ~ + 85ºC Paringssyklusen: 5000 ynfoegings. |
| Dielnûmer | Beskriuwing | PCS/CTN | GW(KG) | CMB(m3) | Bestellingoantal | Tiid | Oarder |
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