SIM-kaartferbining, PUSH PUSH, 8P+1P, H1.85mm, sûnder post KLS1-SIM-074B
Produktôfbyldings
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Produktynformaasje
SIM-kaartferbining, PUSH PUSH, 8P+1P, H1.85mm, sûnder post
Materiaal:
Húsfesting: Hege temperatuer
Termoplastysk, UL94V-0. Swart.
Kontakt: Koperlegering.
Omslach: Kontakt: Koperlegeringen of stiel.
Plating:
Underplaat: Nikkel.
Kontaktgebiet: Goud oer nikkel.
Soldeergebiet: Tin oer Nikkel.
Shell: G/F-plaat oer nikkel op soldeersturten
Elektrysk:
Hjoeddeiske wurdearring: 0.5A.
Spanningswurdearring: 5.0 Vrms.
Isolaasjeresistinsje: 500M Min. By DC 500V DC
Wjerstân tsjin spanning: 250V ACrms foar 1 minút.
Kontaktresistinsje: 100M Max. By 10MA / 20mV MAX.
Bedriuwstemperatuer: -45ºC ~ + 85ºC
Paringssyklusen: 5000 ynfoegings.
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