SIM-kaartferbining, PUSH PUSH, 6P+2P, H1.85mm, sûnder post KLS1-SIM-084
Produktôfbyldings
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Produktynformaasje
SIM-kaartferbining, PUSH PUSH, 6P+2P, H1.85mm, sûnder post
Materiaal:
Behuizing: LCP, UL94V-0
Kontakt: C5210R-H, T=0.15
Skulp: SUS304, T=0.20
Mylar: Polyester.
Bedriuwstemperatuer: -45ºC ~ + 85ºC
Bedriuwstemperatuer: -45ºC ~ + 85ºC
Ein:
Kontakt: Gouden flitsplaat op kontaktgebiet; Gouden flitsplaat op soldeertails, mei folslein kontakt ûnderplaat 50u" min nikkel.
Shell: 50u” min Nikkel Underplated Overall, Goud Flash Plated On Soldeer Tails.
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