SIM-kaartferbining, PUSH PUSH, 6P+1P, H1.9mm, mei post KLS1-SIM-107
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| SIM-kaartferbining, PUSH PUSH, 6P+1P, H1.9mm, mei post Materiaal: Behuizing: Hege-temperatuer plestik, UL94V-0. Rated. Kontakt: Koperlegering. Skulp: Koperlegering/Stiel. Plating: Kontaktgebiet: Gouden flits. Soldeergebiet: 80u" Min, matte tinlegering platearre. Underplaat: 30u" min, Nikkel. Shell: 30u "Min, Nikkel plated algemien Soldeergebiet: Gole flash. Elektrysk: Hjoeddeiske wurdearring: 0.5A. Wjerstân tsjin spanning: AC500V rms Isolaasjeresistinsje: 1000MΩMin, by DC 500V Kontaktresistinsje: 100mΩ Maks. Paringssyklusen: 3000 ynfoegings. Bedriuwstemperatuer: -40%%DC oant +85%%DC |
| Dielnûmer | Beskriuwing | PCS/CTN | GW(KG) | CMB(m3) | Bestellingoantal | Tiid | Oarder |
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