Mikro SIM-kaartferbining; DRUK DRUK, 6P of 6P+1P, H1.35mm KLS1-SIM-069
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| Mikro SIM-kaartferbining; PUSH PUSH, 6P of 6P+1P, H1.35mm, sûnder peal. Materiaal: Isolator: Hege temperatuerTermoplastysk, UL94V-0 Kontakt: Koperlegering, platearre 50U" NiAlgemien kontakt Au 1U Shell: SUS, Plated 50U" Ni Oer it algemien Plated 1u"Au Selektyf Kontaktgebiet Elektrysk: Hjoeddeiske wurdearring: 0.5A Maks. Spanningswurdearring: 5V AC/DC Kontaktresistinsje: 100m Maks. Isolaasjeresistinsje: 1000M Min./500VDC Omjouwingsfochtigensberik: 95% RH Maks. Paringssyklusen: 10000 ynfoegings Paringssyklusen: 5000 ynfoegings Bedriuwstemperatuer: -45ºC ~ + 85ºC |
| Dielnûmer | Beskriuwing | PCS/CTN | GW(KG) | CMB(m3) | Bestellingoantal | Tiid | Oarder |
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