Micro SD 4.0 kaartferbining push push, H1.3mm KLS1-SD4.0-003
Produktôfbyldings
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Produktynformaasje
Micro SD 4.0 kaartferbining push push, H1.3mm
Materiaal:
Isolator: Termysk plestik, patearre UL94V-0.
Kontakten: Fosforbrûns.
Skulp: RVS.
Kontaktplating:
Underplaat: 50u”-100u” Nikkel
Underplaat: 50u”-100u” Nikkel
Kontaktgebiet: Gouden flits
Soldeersturtgebiet: 100u”-200u” Tin
Elektrysk:
Bedriuwsspanning: 10V
Hjoeddeiske wurdearring: 0.5A Min.
Kontaktresistinsje: 100mΩ Maks.
Isolaasjeresistinsje: 1000MΩ
Diëlektryske wjerstân tsjin spanning: 500VAC/1 minút.
Paringssyklusen: 3000 ynfoegings
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